B2B WHOLESALE ONLY eMMC / UFS / BGA IATF 16949 SOURCE FACTORY

Embedded storage you can lock a part number to — eMMC & UFS, straight from the source factory.

BGA-packaged eMMC and UFS in standard JEDEC footprints — commercial and industrial-grade, with the controller, firmware and BOM fixed per order so your firmware qualification holds across re-orders. Die allocation through the 2026 NAND shortage, traceable batches, and no silent die swaps on the next reel.

BGA eMMC and UFS embedded storage on the SMT line at the source factory
eMMC + UFSstandard JEDEC BGA footprints
−40 ~ 85°Cindustrial-grade option
Lockedpart numbers, fixed BOM & firmware
IATF 16949automotive-grade source factory
Figures refer to our source manufacturing partner; exact specs per datasheet, grade and current die availability.

The Problem We Solve

A silent die swap doesn't fail QA — it fails in the field, after you've shipped.

Embedded storage is soldered down. You qualify firmware against a specific eMMC or UFS part, then expect the next reel to behave identically. In the 2026 shortage that assumption breaks: brokers fill gaps with re-marked or mixed die, the big NAND makers issue EOL notices on the densities you designed around, and a "matching" part quietly changes timing or endurance. The fix is supply you can pin down — a source factory that holds die, locks the part number, and ships a traceable batch you can re-qualify, not re-discover.

Part numbers that holdFixed BOM, controller and firmware per order — re-orders match the part you qualified.
Allocation, not the spot marketDie allocation: committed densities while supply is rationed.
Traceable die, no re-marksStraight from the line, batch-traceable — no broker mystery stock soldered into your board.

What We Supply

Embedded storage, by interface and grade

Pick the interface to the design. We quote the package, capacity, grade and temperature range on every line — and confirm against current die availability before you commit a footprint.

eMMC (e.MMC 5.1)

8GB – 256GB · 153/169-ball BGA

  • Mature managed NAND — controller + NAND in one package
  • IoT, industrial control, automotive infotainment, set-top
  • Best cost/proven-reliability for mainstream embedded
COREeMMC

UFS (2.x / 3.1)

32GB – 512GB · 153-ball BGA

  • Serial MIPI M-PHY, full-duplex command queue
  • Several × eMMC throughput, far better random IO
  • High-end mobile, edge-AI, fast large-data devices
HIGH-SPEEDUFS

Industrial / OEM

Wide-temp · pSLC on request · your part number

  • −40 ~ 85°C, higher-endurance & pSLC-mode configs
  • Fixed BOM, controller & firmware lock per order
  • Locked part numbers for repeatable production
INDUSTRIALCUSTOM
Embedded storage — interface comparisonStated per part on the JEDEC datasheet · confirmed against current die availability
InterfaceBus / linkTypical capacity¹BGA packageBest for
eMMC 5.1Parallel 8-bit, half-duplex8GB – 256GB153 / 169-ballIoT, industrial, automotive infotainment
UFS 2.xSerial M-PHY, full-duplex queue32GB – 512GB153-ballMobile, edge-AI, fast large data
UFS 3.1Serial M-PHY (HS-Gear4)128GB – 512GB153-ballHigh-end performance designs
¹ Capacities are the typical supplied range; specific densities and die generations are allocation-dependent in 2026 — ask for current die availability for your exact footprint.   Industrial-temperature (−40 ~ 85°C), pSLC-mode endurance and preload/over-provisioning options are stated on the per-part datasheet, alongside endurance, power-loss and data-retention specs.   Full datasheets and a qualification sample available to qualified buyers on request.

Why Source-Factory

For soldered-down storage, the supplier is the spec

An embedded part is only as dependable as the supply chain behind it. Once it's on the board, a quiet die change is your recall — source-factory control is the whole point.

01
Locked part numbers

Fixed BOM, controller and firmware per order — re-orders match the part you qualified, with any forced die transition flagged ahead with a re-qualification sample.

02
Traceable die — no re-marks

Straight from the source line, batch-traceable. No broker mystery stock and no re-marked die soldered into your product — the part you qualify is the part that ships.

03
Commercial & industrial grade

−40 ~ 85°C, higher-endurance and pSLC-mode configurations, with endurance, power-loss and retention specs stated on the datasheet, not implied.

04
Allocation, confirmed at order

Authorized agent of an IATF 16949 source factory with die allocation — committed densities and stable lead times through the 2026 NAND shortage.

Who Buys This

Built for buyers who solder storage onto a board

Embedded / device OEMsIoT, industrial control and automotive designs that qualify firmware against a fixed part and can't re-spin for a die swap.
ODMs & design housesStandard JEDEC footprints plus custom capacity, firmware and locked part numbers for repeatable production.
Edge-AI & high-perf devicesUFS throughput and random IO for fast large-data workloads at the edge.
Distributors & brokers' alternativeA factory-direct die source with allocation that survives the shortage — without grey-market risk.

Choose the Right Interface

The embedded-storage decision, before you commit a footprint

Same standards as our specs — verifiable, vendor-neutral. Use these to match interface and NAND grade to your design.

eMMC, UFS or SD card for embedded storage?

How interface, footprint and cost decide which one fits your device.

SLC / MLC / TLC / QLC / pSLC explained

What pSLC mode is and why it changes endurance for embedded designs.

How to vet a flash-memory supplier

Traceability, locked BOM and die provenance — what to ask before you design in a part.

FAQ

Embedded storage — sourcing questions

eMMC vs UFS — which embedded storage should we design in?
eMMC and UFS solve different points on the cost/performance curve. eMMC (e.MMC 5.1) is the mature, lower-cost managed-NAND standard: a single BGA package with controller and NAND inside, a parallel 8-bit bus, and a half-duplex command model — ideal for IoT, industrial control, automotive infotainment and any design that needs proven, low-overhead storage. UFS (2.x / 3.1) uses a serial MIPI M-PHY link with full-duplex queuing (command queue), so it delivers several times the throughput and far better random IO — the right choice for high-end mobile, edge-AI and anything moving large data fast. We supply both in standard JEDEC footprints; tell us your bus, capacity and footprint and we quote the part that fits, not the part we want to push.
Do you offer industrial-grade embedded storage (wide temperature, longer endurance)?
Yes. Beyond commercial-grade parts we supply industrial-temperature eMMC and UFS (−40 ~ 85°C options) and higher-endurance configurations including pSLC-mode NAND for write-heavy or long-life designs. Industrial parts carry tighter power-loss handling, ECC and data-retention specs — all stated on the per-part datasheet rather than implied. Because grade and die generation vary by allocation, ask for current die availability and we confirm exactly what can ship against your footprint and temperature range.
Can you actually source embedded storage in the current allocation / shortage?
That is the whole reason to talk to a source factory rather than a broker. As an authorized agent of an IATF 16949 source factory in Guangdong we confirm wafer/die availability at order, so we can commit part numbers and lead times while the spot market is rationed. The honest caveat: BGA/eMMC/UFS supply is allocation-dependent in 2026 — specific densities and die generations come and go — so the right first step is to ask for current die availability for your exact capacity and footprint, and we lock it before it moves.
Will the part number stay the same across re-orders, or do you swap the die silently?
Locked part numbers and a fixed BOM per order — no silent die swaps. Embedded designs cannot tolerate a quiet NAND or controller change: it breaks your firmware qualification, timing and EOL planning. Every part ships with a fixed controller/firmware and a traceable batch, and we flag any forced die transition in advance with a re-qualification sample, never as a surprise on the next reel.
The big NAND brands are pulling out of commodity storage — does that hurt embedded OEMs like us?
It is the defining supply story of 2026. With the NAND shortage running hot (industry relief is not expected until roughly 2027 Q4–2028) the major makers are reallocating capacity to high-margin B2B and AI/datacenter demand and quietly exiting commodity and mid-tier device storage. For embedded OEMs that means longer lead times, EOL notices on the densities you designed around, and brokers filling the gap with re-marked or mixed stock. Factory-direct allocation is the counter-move: a source factory that holds die, commits part numbers and ships traceable batches fills exactly the vacuum the big brands left — without the grey-market risk.
Can you OEM / customize firmware, capacity and footprint for our device?
Yes. We supply standard JEDEC BGA footprints (eMMC 153/169-ball, UFS 153-ball and common variants) and support customer-specified capacity, firmware configuration, fixed BOM and locked part numbers for repeatable production. Preload, over-provisioning and endurance-mode (pSLC) options are available where the design calls for it. Send the schematic footprint, target density and volume and we return a real factory quote — usually the same business day.

Request for Quote

Lock your embedded supply — quote in 24 hours

Tell us interface (eMMC or UFS), capacity, footprint, grade and monthly volume. We reply with a real factory quote — usually the same business day — confirmed against current die availability, with a qualification sample on request so you can verify before you design it in.

B2B inquiries only. Quotes valid 3–7 days, subject to final confirmation and current die availability — the NAND market is moving fast.